Daily Papers

Although recent methods have tried to introduce large multimodal models (LMMs) into industrial anomaly detection (IAD), their generalization in the IAD field is far inferior to that for general purposes. We summarize the main reasons for this gap into two aspects. On one hand, general-purpose LMMs lack cognition of defects in the visual modality, thereby failing to sufficiently focus on defect areas. Therefore, we propose to modify the AnyRes structure of the LLaVA model, providing the potential anomalous areas identified by existing IAD models to the LMMs. On the other hand, existing methods mainly focus on identifying defects by learning defect patterns or comparing with normal samples, yet they fall short of understanding the causes of these defects. Considering that the generation of defects is closely related to the manufacturing process, we propose a manufacturing-driven IAD paradigm. An instruction-tuning dataset for IAD (InstructIAD) and a data organization approach for Chain-of-Thought with manufacturing (CoT-M) are designed to leverage the manufacturing process for IAD. Based on the above two modifications, we present Triad, a novel LMM-based method incorporating an expert-guided region-of-interest tokenizer and manufacturing process for industrial anomaly detection. Extensive experiments show that our Triad not only demonstrates competitive performance against current LMMs but also achieves further improved accuracy when equipped with manufacturing processes. Source code, training data, and pre-trained models will be publicly available at https://github.com/tzjtatata/Triad.

Camouflaged object segmentation presents unique challenges compared to traditional segmentation tasks, primarily due to the high similarity in patterns and colors between camouflaged objects and their backgrounds. Effective solutions to this problem have significant implications in critical areas such as pest control, defect detection, and lesion segmentation in medical imaging. Prior research has predominantly emphasized supervised or unsupervised pre-training methods, leaving zero-shot approaches significantly underdeveloped. Existing zero-shot techniques commonly utilize the Segment Anything Model (SAM) in automatic mode or rely on vision-language models to generate cues for segmentation; however, their performances remain unsatisfactory, due to the similarity of the camouflaged object and the background. This work studies how to avoid training by integrating large pre-trained models like SAM-2 and Owl-v2 with temporal information into a modular pipeline. Evaluated on the MoCA-Mask dataset, our approach achieves outstanding performance improvements, significantly outperforming existing zero-shot methods by raising the F-measure (F_beta^w) from 0.296 to 0.628. Our approach also surpasses supervised methods, increasing the F-measure from 0.476 to 0.628. Additionally, evaluation on the MoCA-Filter dataset demonstrates an increase in the success rate from 0.628 to 0.697 when compared with FlowSAM, a supervised transfer method. A thorough ablation study further validates the individual contributions of each component. Besides our main contributions, we also highlight inconsistencies in previous work regarding metrics and settings. Code can be found in https://github.com/weathon/vcos.

Quality control is of vital importance during electronics production. As the methods of producing electronic circuits improve, there is an increasing chance of solder defects during assembling the printed circuit board (PCB). Many technologies have been incorporated for inspecting failed soldering, such as X-ray imaging, optical imaging, and thermal imaging. With some advanced algorithms, the new technologies are expected to control the production quality based on the digital images. However, current algorithms sometimes are not accurate enough to meet the quality control. Specialists are needed to do a follow-up checking. For automated X-ray inspection, joint of interest on the X-ray image is located by region of interest (ROI) and inspected by some algorithms. Some incorrect ROIs deteriorate the inspection algorithm. The high dimension of X-ray images and the varying sizes of image dimensions also challenge the inspection algorithms. On the other hand, recent advances on deep learning shed light on image-based tasks and are competitive to human levels. In this paper, deep learning is incorporated in X-ray imaging based quality control during PCB quality inspection. Two artificial intelligence (AI) based models are proposed and compared for joint defect detection. The noised ROI problem and the varying sizes of imaging dimension problem are addressed. The efficacy of the proposed methods are verified through experimenting on a real-world 3D X-ray dataset. By incorporating the proposed methods, specialist inspection workload is largely saved.

Being able to spot defective parts is a critical component in large-scale industrial manufacturing. A particular challenge that we address in this work is the cold-start problem: fit a model using nominal (non-defective) example images only. While handcrafted solutions per class are possible, the goal is to build systems that work well simultaneously on many different tasks automatically. The best performing approaches combine embeddings from ImageNet models with an outlier detection model. In this paper, we extend on this line of work and propose PatchCore, which uses a maximally representative memory bank of nominal patch-features. PatchCore offers competitive inference times while achieving state-of-the-art performance for both detection and localization. On the challenging, widely used MVTec AD benchmark PatchCore achieves an image-level anomaly detection AUROC score of up to 99.6%, more than halving the error compared to the next best competitor. We further report competitive results on two additional datasets and also find competitive results in the few samples regime.^* Work done during a research internship at Amazon AWS. Code: github.com/amazon-research/patchcore-inspection.

Anomaly detection is a crucial process in industrial manufacturing and has made significant advancements recently. However, there is a large variance between the data used in the development and the data collected by the production environment. Therefore, we present the Texture-AD benchmark based on representative texture-based anomaly detection to evaluate the effectiveness of unsupervised anomaly detection algorithms in real-world applications. This dataset includes images of 15 different cloth, 14 semiconductor wafers and 10 metal plates acquired under different optical schemes. In addition, it includes more than 10 different types of defects produced during real manufacturing processes, such as scratches, wrinkles, color variations and point defects, which are often more difficult to detect than existing datasets. All anomalous areas are provided with pixel-level annotations to facilitate comprehensive evaluation using anomaly detection models. Specifically, to adapt to diverse products in automated pipelines, we present a new evaluation method and results of baseline algorithms. The experimental results show that Texture-AD is a difficult challenge for state-of-the-art algorithms. To our knowledge, Texture-AD is the first dataset to be devoted to evaluating industrial defect detection algorithms in the real world. The dataset is available at https://XXX.

Defect inspection is paramount within the closed-loop manufacturing system. However, existing datasets for defect inspection often lack precision and semantic granularity required for practical applications. In this paper, we introduce the Defect Spectrum, a comprehensive benchmark that offers precise, semantic-abundant, and large-scale annotations for a wide range of industrial defects. Building on four key industrial benchmarks, our dataset refines existing annotations and introduces rich semantic details, distinguishing multiple defect types within a single image. Furthermore, we introduce Defect-Gen, a two-stage diffusion-based generator designed to create high-quality and diverse defective images, even when working with limited datasets. The synthetic images generated by Defect-Gen significantly enhance the efficacy of defect inspection models. Overall, The Defect Spectrum dataset demonstrates its potential in defect inspection research, offering a solid platform for testing and refining advanced models.

Industrial anomaly detection (IAD) has garnered significant attention and experienced rapid development. However, the recent development of IAD approach has encountered certain difficulties due to dataset limitations. On the one hand, most of the state-of-the-art methods have achieved saturation (over 99% in AUROC) on mainstream datasets such as MVTec, and the differences of methods cannot be well distinguished, leading to a significant gap between public datasets and actual application scenarios. On the other hand, the research on various new practical anomaly detection settings is limited by the scale of the dataset, posing a risk of overfitting in evaluation results. Therefore, we propose a large-scale, Real-world, and multi-view Industrial Anomaly Detection dataset, named Real-IAD, which contains 150K high-resolution images of 30 different objects, an order of magnitude larger than existing datasets. It has a larger range of defect area and ratio proportions, making it more challenging than previous datasets. To make the dataset closer to real application scenarios, we adopted a multi-view shooting method and proposed sample-level evaluation metrics. In addition, beyond the general unsupervised anomaly detection setting, we propose a new setting for Fully Unsupervised Industrial Anomaly Detection (FUIAD) based on the observation that the yield rate in industrial production is usually greater than 60%, which has more practical application value. Finally, we report the results of popular IAD methods on the Real-IAD dataset, providing a highly challenging benchmark to promote the development of the IAD field.

Automatic detecting anomalous regions in images of objects or textures without priors of the anomalies is challenging, especially when the anomalies appear in very small areas of the images, making difficult-to-detect visual variations, such as defects on manufacturing products. This paper proposes an effective unsupervised anomaly segmentation approach that can detect and segment out the anomalies in small and confined regions of images. Concretely, we develop a multi-scale regional feature generator that can generate multiple spatial context-aware representations from pre-trained deep convolutional networks for every subregion of an image. The regional representations not only describe the local characteristics of corresponding regions but also encode their multiple spatial context information, making them discriminative and very beneficial for anomaly detection. Leveraging these descriptive regional features, we then design a deep yet efficient convolutional autoencoder and detect anomalous regions within images via fast feature reconstruction. Our method is simple yet effective and efficient. It advances the state-of-the-art performances on several benchmark datasets and shows great potential for real applications.

Shrinking pattern dimensions leads to an increased variety of defect types in semiconductor devices. This has spurred innovation in patterning approaches such as Directed self-assembly (DSA) for which no traditional, automatic defect inspection software exists. Machine Learning-based SEM image analysis has become an increasingly popular research topic for defect inspection with supervised ML models often showing the best performance. However, little research has been done on obtaining a dataset with high-quality labels for these supervised models. In this work, we propose a method for obtaining coherent and complete labels for a dataset of hexagonal contact hole DSA patterns while requiring minimal quality control effort from a DSA expert. We show that YOLOv8, a state-of-the-art neural network, achieves defect detection precisions of more than 0.9 mAP on our final dataset which best reflects DSA expert defect labeling expectations. We discuss the strengths and limitations of our proposed labeling approach and suggest directions for future work in data-centric ML-based defect inspection.

Manufacturing wafers is an intricate task involving thousands of steps. Defect Pattern Recognition (DPR) of wafer maps is crucial for determining the root cause of production defects, which may further provide insight for yield improvement in wafer foundry. During manufacturing, various defects may appear standalone in the wafer or may appear as different combinations. Identifying multiple defects in a wafer is generally harder compared to identifying a single defect. Recently, deep learning methods have gained significant traction in mixed-type DPR. However, the complexity of defects requires complex and large models making them very difficult to operate on low-memory embedded devices typically used in fabrication labs. Another common issue is the unavailability of labeled data to train complex networks. In this work, we propose an unsupervised training routine to distill the knowledge of complex pre-trained models to lightweight deployment-ready models. We empirically show that this type of training compresses the model without sacrificing accuracy despite being up to 10 times smaller than the teacher model. The compressed model also manages to outperform contemporary state-of-the-art models.

Point defects play a central role in driving the properties of materials. First-principles methods are widely used to compute defect energetics and structures, including at scale for high-throughput defect databases. However, these methods are computationally expensive, making machine-learning force fields (MLFFs) an attractive alternative for accelerating structural relaxations. Most existing MLFFs are based on graph neural networks (GNNs), which can suffer from oversmoothing and poor representation of long-range interactions. Both of these issues are especially of concern when modeling point defects. To address these challenges, we introduce the Accelerated Deep Atomic Potential Transformer (ADAPT), an MLFF that replaces graph representations with a direct coordinates-in-space formulation and explicitly considers all pairwise atomic interactions. Atoms are treated as tokens, with a Transformer encoder modeling their interactions. Applied to a dataset of silicon point defects, ADAPT achieves a roughly 33 percent reduction in both force and energy prediction errors relative to a state-of-the-art GNN-based model, while requiring only a fraction of the computational cost.

Anomaly Detection and Segmentation (AD&S) is crucial for industrial quality control. While existing methods excel in generating anomaly scores for each pixel, practical applications require producing a binary segmentation to identify anomalies. Due to the absence of labeled anomalies in many real scenarios, standard practices binarize these maps based on some statistics derived from a validation set containing only nominal samples, resulting in poor segmentation performance. This paper addresses this problem by proposing a test time training strategy to improve the segmentation performance. Indeed, at test time, we can extract rich features directly from anomalous samples to train a classifier that can discriminate defects effectively. Our general approach can work downstream to any AD&S method that provides an anomaly score map as output, even in multimodal settings. We demonstrate the effectiveness of our approach over baselines through extensive experimentation and evaluation on MVTec AD and MVTec 3D-AD.

Understanding electron irradiation effects is vital not only for reliable transmission electron microscopy characterization, but increasingly also for the controlled manipulation of two-dimensional materials. The displacement cross sections of monolayer hBN are measured using aberration-corrected scanning transmission electron microscopy in near ultra-high vacuum at primary beam energies between 50 and 90 keV. Damage rates below 80 keV are up to three orders of magnitude lower than previously measured at edges under poorer residual vacuum conditions where chemical etching appears to have been dominant. Notably, is possible to create single vacancies in hBN using electron irradiation, with boron almost twice as likely as nitrogen to be ejected below 80 keV. Moreover, any damage at such low energies cannot be explained by elastic knock-on, even when accounting for vibrations of the atoms. A theoretical description is developed to account for lowering of the displacement threshold due to valence ionization resulting from inelastic scattering of probe electrons, modelled using charge-constrained density functional theory molecular dynamics. Although significant reductions are found depending on the constrained charge, quantitative predictions for realistic ionization states are currently not possible. Nonetheless, there is potential for defect-engineering of hBN at the level of single vacancies using electron irradiation.

As the globalization of semiconductor design and manufacturing processes continues, the demand for defect detection during integrated circuit fabrication stages is becoming increasingly critical, playing a significant role in enhancing the yield of semiconductor products. Traditional wafer map defect pattern detection methods involve manual inspection using electron microscopes to collect sample images, which are then assessed by experts for defects. This approach is labor-intensive and inefficient. Consequently, there is a pressing need to develop a model capable of automatically detecting defects as an alternative to manual operations. In this paper, we propose a method that initially employs a pre-trained VAE model to obtain the fault distribution information of the wafer map. This information serves as guidance, combined with the original image set for semi-supervised model training. During the semi-supervised training, we utilize a teacher-student network for iterative learning. The model presented in this paper is validated on the benchmark dataset WM-811K wafer dataset. The experimental results demonstrate superior classification accuracy and detection performance compared to state-of-the-art models, fulfilling the requirements for industrial applications. Compared to the original architecture, we have achieved significant performance improvement.

To efficiently deploy strong, often pre-trained feature extractors, recent Industrial Anomaly Detection and Segmentation (IADS) methods process low-resolution images, e.g., 224x224 pixels, obtained by downsampling the original input images. However, while numerous industrial applications demand the identification of both large and small defects, downsampling the input image to a low resolution may hinder a method's ability to pinpoint tiny anomalies. We propose a novel Teacher--Student paradigm to leverage strong pre-trained features while processing high-resolution input images very efficiently. The core idea concerns training two shallow MLPs (the Students) by nominal images so as to mimic the mappings between the patch embeddings induced by the self-attention layers of a frozen vision Transformer (the Teacher). Indeed, learning these mappings sets forth a challenging pretext task that small-capacity models are unlikely to accomplish on out-of-distribution data such as anomalous images. Our method can spot anomalies from high-resolution images and runs way faster than competitors, achieving state-of-the-art performance on MVTec AD and the best segmentation results on VisA. We also propose novel evaluation metrics to capture robustness to defect size, i.e., the ability to preserve good localisation from large anomalies to tiny ones. Evaluating our method also by these metrics reveals its neatly superior performance.

Surface defects are a primary source of yield loss in manufacturing, yet existing anomaly detection methods often fail in real-world deployment due to limited and unrepresentative datasets. To overcome this, we introduce 3D-ADAM, a 3D Anomaly Detection in Additive Manufacturing dataset, that is the first large-scale, industry-relevant dataset for RGB+3D surface defect detection in additive manufacturing. 3D-ADAM comprises 14,120 high-resolution scans of 217 unique parts, captured with four industrial depth sensors, and includes 27,346 annotated defects across 12 categories along with 27,346 annotations of machine element features in 16 classes. 3D-ADAM is captured in a real industrial environment and as such reflects real production conditions, including variations in part placement, sensor positioning, lighting, and partial occlusion. Benchmarking state-of-the-art models demonstrates that 3D-ADAM presents substantial challenges beyond existing datasets. Validation through expert labelling surveys with industry partners further confirms its industrial relevance. By providing this benchmark, 3D-ADAM establishes a foundation for advancing robust 3D anomaly detection capable of meeting manufacturing demands.

Visual surface anomaly detection aims to detect local image regions that significantly deviate from normal appearance. Recent surface anomaly detection methods rely on generative models to accurately reconstruct the normal areas and to fail on anomalies. These methods are trained only on anomaly-free images, and often require hand-crafted post-processing steps to localize the anomalies, which prohibits optimizing the feature extraction for maximal detection capability. In addition to reconstructive approach, we cast surface anomaly detection primarily as a discriminative problem and propose a discriminatively trained reconstruction anomaly embedding model (DRAEM). The proposed method learns a joint representation of an anomalous image and its anomaly-free reconstruction, while simultaneously learning a decision boundary between normal and anomalous examples. The method enables direct anomaly localization without the need for additional complicated post-processing of the network output and can be trained using simple and general anomaly simulations. On the challenging MVTec anomaly detection dataset, DRAEM outperforms the current state-of-the-art unsupervised methods by a large margin and even delivers detection performance close to the fully-supervised methods on the widely used DAGM surface-defect detection dataset, while substantially outperforming them in localization accuracy.

Manufacturing wafers is an intricate task involving thousands of steps. Defect Pattern Recognition (DPR) of wafer maps is crucial to find the root cause of the issue and further improving the yield in the wafer foundry. Mixed-type DPR is much more complicated compared to single-type DPR due to varied spatial features, the uncertainty of defects, and the number of defects present. To accurately predict the number of defects as well as the types of defects, we propose a novel compact deformable convolutional transformer (DC Transformer). Specifically, DC Transformer focuses on the global features present in the wafer map by virtue of learnable deformable kernels and multi-head attention to the global features. The proposed method succinctly models the internal relationship between the wafer maps and the defects. DC Transformer is evaluated on a real dataset containing 38 defect patterns. Experimental results show that DC Transformer performs exceptionally well in recognizing both single and mixed-type defects. The proposed method outperforms the current state of the models by a considerable margin

Industrial anomaly detection achieves progress thanks to datasets such as MVTec-AD and VisA. However, they suf- fer from limitations in terms of the number of defect sam- ples, types of defects, and availability of real-world scenes. These constraints inhibit researchers from further exploring the performance of industrial detection with higher accuracy. To this end, we propose a new large-scale anomaly detection dataset called 3CAD, which is derived from real 3C produc- tion lines. Specifically, the proposed 3CAD includes eight different types of manufactured parts, totaling 27,039 high- resolution images labeled with pixel-level anomalies. The key features of 3CAD are that it covers anomalous regions of different sizes, multiple anomaly types, and the possibility of multiple anomalous regions and multiple anomaly types per anomaly image. This is the largest and first anomaly de- tection dataset dedicated to 3C product quality control for community exploration and development. Meanwhile, we in- troduce a simple yet effective framework for unsupervised anomaly detection: a Coarse-to-Fine detection paradigm with Recovery Guidance (CFRG). To detect small defect anoma- lies, the proposed CFRG utilizes a coarse-to-fine detection paradigm. Specifically, we utilize a heterogeneous distilla- tion model for coarse localization and then fine localiza- tion through a segmentation model. In addition, to better capture normal patterns, we introduce recovery features as guidance. Finally, we report the results of our CFRG frame- work and popular anomaly detection methods on the 3CAD dataset, demonstrating strong competitiveness and providing a highly challenging benchmark to promote the development of the anomaly detection field. Data and code are available: https://github.com/EnquanYang2022/3CAD.